The semiconductor industry is experiencing a golden run. Over the past five years, the industry as become the backbone against which AI has expanded, forcing semi-conductor companies to evolve and adapt non-stop and pushing them to develop efficiencies like never before.
The need for these efficiencies places extreme demands on materials used in equipment, tooling, and handling systems. As device geometries shrink and process complexity increases, components must perform reliably under high temperatures, aggressive chemistries, ultra-clean environments, and tight dimensional tolerances. In this context, high-performance polymers have become essential engineering materials.
Among the most widely used are PEEK (Polyether Ether Ketone), PPS (Polyphenylene Sulfide), and Polyimide. Each offers a distinct balance of thermal stability, chemical resistance, mechanical strength, and electrical performance, making them suitable for different roles across wafer fabrication, inspection, testing, and packaging equipment.
This article examines how these three materials are used in semiconductor applications, what differentiates them, and how engineers select the appropriate polymer for critical components.
The Role of High-Performance Polymers in Semiconductor Manufacturing
Semiconductor fabrication environments are uniquely harsh. Components may be exposed to:
- Strong acids, alkalis, and solvents used in wet processing
- Plasma gases and reactive by-products in dry etching and deposition
- Elevated and cyclic temperatures
- Vacuum conditions requiring low outgassing
- Stringent contamination limits, where even microscopic particles can affect yield
Traditional metals such as aluminium and stainless steel offer strength but can suffer from corrosion, particle shedding, and unwanted electrical conductivity. Commodity plastics often lack the thermal and chemical resistance required.
High-performance polymers fill this gap by combining chemical inertness, electrical insulation, dimensional stability, and low contamination behaviour, making them indispensable in modern semiconductor tools.
PEEK Components in Semiconductor Applications
PEEK is one of the most versatile polymers used in semiconductor equipment. It provides an excellent combination of mechanical strength, thermal resistance, and chemical compatibility.
PEEK retains mechanical integrity at continuous operating temperatures of approximately 250 °C and withstands short-term excursions beyond this range. It is resistant to a wide spectrum of chemicals, including many acids, bases, and organic solvents used in semiconductor processing.
From a contamination perspective, PEEK offers low outgassing under vacuum and good wear characteristics, helping minimise particle generation. These properties make it suitable for both front-end and back-end semiconductor equipment.
Typical semiconductor components made from PEEK include wafer handling fingers, insulating spacers, precision bushings, valve seats, and structural parts used in inspection and metrology systems. Filled grades, such as glass- or carbon-reinforced PEEK, are often specified where increased stiffness, improved wear resistance, or tighter dimensional control is required.
PPS Components in Semiconductor Processing Equipment
PPS is widely used in semiconductor applications where chemical resistance and dimensional stability are critical, but operating temperatures are more moderate.
PPS exhibits excellent resistance to acids, alkalis, and solvents, and has very low moisture absorption. This makes it particularly well suited for wet chemical environments where dimensional changes due to humidity must be minimised.
While PPS has a lower continuous service temperature than PEEK, typically around 200–220 °C, it performs reliably in many chemical delivery and wafer processing applications. Its inherent flame resistance and electrical insulation properties further support its use in semiconductor tools.
PPS is commonly injection moulded, enabling the economical production of complex, high-volume components such as pump housings, valve bodies, manifolds, wafer carriers, and cassette parts. Glass-filled PPS grades are often selected to improve stiffness and creep resistance in load-bearing applications.
Polyimide Components for Extreme Semiconductor Conditions
Polyimide represents the highest performance class among organic polymers used in semiconductor manufacturing. It is selected for applications involving extreme temperatures, demanding electrical requirements, or prolonged exposure to harsh environments.
Polyimide materials can operate continuously at temperatures exceeding 300 °C and tolerate short-term exposure to significantly higher temperatures. They retain mechanical strength and dielectric properties under thermal cycling, vacuum conditions, and radiation exposure.
Electrically, polyimide offers excellent dielectric strength, stable insulation performance, and low dielectric loss, making it indispensable in test and inspection systems.
In semiconductor equipment, polyimide is used for high-temperature insulators, test sockets, probe card components, wafer supports, and alignment parts. Thin polyimide films are also widely used in advanced packaging and flexible circuitry.
Because of its performance and processing complexity, polyimide is typically reserved for mission-critical components where failure is not an option.
Materials Comparison: PEEK vs PPS vs Polyimide in Semiconductor Use
Property / Criteria | PEEK | PPS | Polyimide |
Continuous Service Temperature | ~250 °C | ~200–220 °C | >300 °C |
Chemical Resistance | Excellent; resists most process chemicals | Excellent; particularly strong in wet chemistry | Excellent; stable under aggressive conditions |
Mechanical Strength | High; retains strength at elevated temperatures | Moderate; good stiffness, lower toughness than PEEK | Moderate to high, depending on grade |
Dimensional Stability | Very good, especially in filled grades | Excellent due to low moisture absorption | Very good, even under thermal cycling |
Electrical Insulation | Good dielectric properties | Good electrical insulation | Outstanding dielectric strength and stability |
Outgassing/Cleanliness | Low; suitable for vacuum environments | Low; suitable for cleanroom use | Very low; ideal for critical applications |
Manufacturing Methods | Precision machining, limited moulding | Injection moulding, machining | Machining, moulding, films |
Typical Semiconductor Applications | Wafer handling parts, insulators, structural components | Chemical delivery parts, valve bodies, wafer carriers | Test sockets, high-temperature insulators, probe components |
Relative Cost | High | Medium | Very high |
Selecting the Right Polymer for Semiconductor Components
Material selection in semiconductor equipment is driven by application-specific requirements rather than a single “best” material.
PEEK is often chosen when a balance of strength, temperature resistance, and cleanliness is required. PPS is preferred for chemically aggressive environments where temperatures are moderate and cost-effective, high-volume production is important. Polyimide is specified when extreme thermal stability or superior electrical performance is critical.
In many semiconductor tools, all three materials may be used within the same system, each optimised for a specific function.
Manufacturing Considerations for Semiconductor-Grade Polymer Components
Beyond material selection, manufacturing quality is critical. Precision machining, controlled moulding processes, and appropriate post-processing are essential to achieve consistent performance.
Key considerations include tight dimensional tolerances, low internal stresses, clean surface finishes, and controlled particle generation. For semiconductor applications, manufacturing expertise often matters as much as material choice.
Conclusion
PEEK, PPS, and Polyimide have become foundational materials in semiconductor manufacturing. Their ability to withstand harsh chemistries, elevated temperatures, and ultra-clean environments enables reliable, high-yield semiconductor production.
By carefully matching material properties to application requirements—and by working with manufacturers experienced in semiconductor-grade polymer processing—OEMs and equipment designers can improve tool reliability, extend component life, and reduce overall cost of ownership.
Read More
1. PFA Skived Tapes - Properties and Applications in High-Performance Environments
2. Regular Skived PTFE Tape vs Tensilized PTFE Tape - A Comparison of Properties, Applications, and Cost
3. PEEK + Carbon Fibre vs. PEEK–Carbon Composite - A Technical Comparison of Strength, Performance, and Cost
